humanoid

Rhoban Microban — Specs, Price & Where to Buy (2026)

A small, fully 3D-printed open-source humanoid, about 30 cm tall, by Marc Duclusaud of the Rhoban team (LaBRI, University of Bordeaux): 19 Dynamixel XL330 servos, a Raspberry Pi Zero 2 W and two 18650 cells, about $567 in parts. It walks with a policy trained in simulation.

📅First Built
2026
🌍Origin
FR
📏Height
30 cm
🦾Degrees of freedom
19
🛒Availability
—

What is the Rhoban Microban?

A small, fully 3D-printed open-source humanoid, about 30 cm tall, by Marc Duclusaud of the Rhoban team (LaBRI, University of Bordeaux): 19 Dynamixel XL330 servos, a Raspberry Pi Zero 2 W and two 18650 cells, about $567 in parts. It walks with a policy trained in simulation.

Specifications

Facts about the Rhoban Microban from its project's published documentation, design files and its makers' own figures. A figure marked Estimate is worked out from those files or parts lists rather than stated by the maker.

SpecDetail
HeightAbout 30 cm (README); its 3D model measures 32.7 cm from the soles to the top of the head.
MassNot published as a weighed figure. The link masses in the 3D model (a modelled value, screws included) add up to 0.82 kg (818.9 g); with about 40 g of cables it leaves out, the authors estimate 0.86 kg.
Degrees of freedom19: 6 per leg (hip yaw, roll and pitch, knee, ankle pitch and roll), 3 per arm (shoulder pitch and roll, elbow) and 1 to turn the head.
Actuators19 × ROBOTIS Dynamixel XL330-M288-T servos, daisy-chained on one bus at 1 Mbps; fed straight from the 2-cell 18650 battery (8.4 V full, about 7.4 V nominal), above the XL330's rated 3.7–6.0 V, and the servos' input-voltage error is switched off (assembly guide).
Onboard computerRaspberry Pi Zero 2 W with Pollen Robotics' open RPI Robot Hat (servo bus, IMU, audio).
SensorsAn IMU on Pollen's RPI Robot Hat (Microban's code reads a Bosch BMI088 over I2C) and the servos' own position, speed, current and voltage readings. Pollen's newest hat revision (D1, 6 Oct 2026) moves to an LSM6DSV16X IMU, so a hat made now may need a code change. No camera: the head is "just cosmetic" for now.
BatteryTwo 18650 Li-ion cells in series (2S, 8.4 V full) with a BMS; Murata VTC6 recommended (3,120 mAh each). Charged over USB-C on the robot, whether it is on or off.
Printed parts21 part designs in PLA (42 pieces; the README says about 30 parts), at 0.12 mm layers and 15% infill; under one roll of filament.
Parts cost$567.35 at the BOM's listed prices ("approximately $567"; the README says $550–600), $623.45 with the servo setup tools. Not sold assembled: you build it yourself.
WalkingA neural-network policy trained in simulation (MjLab) walks it; the training environments are open (MarcDcls/mjlab_microban). It can be driven from a keyboard or a Bluetooth Xbox controller.
ReleasedFirst release v0.0.1 on 21 June 2026 and version 1.0.0 on 6 July 2026 (with a Zenodo DOI); a walking demo went on YouTube on 29 June 2026. The repository was created on 6 May 2026.

3D model

The interactive 3D model on this page is converted from the project's published design: Microban by Marc Duclusaud (Rhoban team, LaBRI, University of Bordeaux), github.com/Rhoban/microban. 3D model under CC BY-NC-SA 4.0: non-commercial use, with credit, shared alike.

Sources

Microban in 3D

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Drag to rotate · click the model, then scroll or pinch to zoom · click a part to inspectSwipe sideways to turn · pinch to zoom · tap a part to inspect3D model credit and licence

Microban supply chain

Point at or select a step to light up its chain: bright lines are its direct links, softer lines the rest of the path from raw material to robot.

Swipe sideways to follow the whole chain.

ExtractionRefiningMaterialsComponentsModulesRobotsThe Zero 2 W is powered by RP3A0.RP3A0 combines the BCM2710A1 die …… and a 4 Gbit Micron LPDDR2 die.Raspberry Pi (Oct 2021): products other than Pi 4, Pi 400 and CM4 are 'built on 40nm silicon'. The Zero 2 W uses the launch Raspberry Pi 3's die.PLA filament is made of polylactic acid.Lactic acid feeds PLA polymer production.PLA is plant-based.Lithium compounds (carbonate, chloride, hydroxide) are produced from mined lithium.Lithium is produced from brine and mineral operations.Mined copper is smelted and refined.A lithium-ion cell has a cathode (positive electrode), typically a metal oxide or phosphate. IEA tracks the 2025 mix of LFP and nickel-based cathodes in electric-car batteries.Silicon metal is made from silica in natural forms such as quartzite (USGS).Chipmakers build their chips on silicon wafers (Micron's annual report lists silicon wafers among its materials and wafer fabrication as its first step); silicon metal can be refined further into ultra-high-purity, semiconductor-grade silicon (polysilicon) (USGS).Silicon metal can be refined further into ultra-high-purity semiconductor-grade silicon, called polysilicon (USGS). Chips are made on wafers: thin slices of crystalline silicon (Wikipedia).Memory is made on silicon wafers (Micron lists silicon wafers among its key materials); wafer silicon is refined from silicon metal (USGS).In wire-bond packaging, fine gold or copper wire connects each die to its leadframe or substrate. ASE is gradually replacing gold wire with copper to cut material cost, though gold wire is still one of its main materials.Steel is made from iron ore: US mines shipped 98% of their usable iron ore to the steel industry (USGS).Bosch makes its MEMS sensors in its own fabs in Reutlingen and Dresden; a MEMS sensor is a MEMS element plus an evaluation chip (ASIC).A MEMS sensor is packed in a semiconductor housing, such as an LGA package (Bosch).The die is a Micron 4 Gbit LPDDR2 (Raspberry Pi); Micron makes its memory in its own fabs.Mined cobalt is refined further into chemicals or metal (Cobalt Institute). In 2025 DR Congo's export restrictions left refiners short of cobalt hydroxide feed and forced some to limit production, though world refined output still rose 5% to 240 kt (Cobalt Institute).Cobalt sulphate, the largest refined cobalt product, is typically used in NCM (NMC) batteries, and cobalt tetroxide often in LCO batteries (Cobalt Institute). Cobalt-free substitutes that use iron and phosphorus (LFP) held a significant market share in China (USGS).Mined nickel ore and concentrate go to smelters and refineries. In Indonesia, laterite ore is processed into nickel pig iron and ferronickel for stainless steel, or into battery intermediates such as mixed hydroxide precipitate (IEA); the US Eagle Mine's concentrate is exported to smelters (USGS).Battery cathodes need nickel sulphate, made from Class I nickel metal or from intermediates such as mixed hydroxide precipitate and nickel matte (IEA). LFP (lithium iron phosphate) cathodes contain no nickel.Stainless steel is the biggest use of nickel, 66% of demand in 2025 (Cobalt Institute). In the US, stainless and alloy steels and nickel alloys take more than 85% of nickel use (USGS). The world made 64.2 Mt of stainless steel in 2025 (worldstainless), against about 1,900 Mt of raw steel (USGS).Lithium-ion cathodes are lithium compounds, generally a layered oxide (such as lithium cobalt oxide), a phosphate (lithium iron phosphate) or a spinel (lithium manganese oxide). Batteries took an estimated 88% of world lithium in 2025 (USGS).Natural graphite flakes must be made into spherical particles, purified to over 99.95% carbon and coated before they can be used in lithium-ion battery anodes (IEA). Natural graphite is now a small part of anode supply: under 8% of China's 2025 anode shipments (GGII), and about 14% worldwide in 2022 (Rystad).Synthetic graphite is made by calcining and graphitising petroleum coke or needle coke at nearly 3,000 °C (IEA). It was 92.7% of China's 2025 anode shipments (GGII).The negative electrode (anode) of a conventional lithium-ion cell is typically graphite. IEA's 2025 data on electric-car battery anodes show only graphite and silicon-doped graphite.89.8% of the world's plastics in 2024 were made from fossil feedstock (Plastics Europe).Solder is the largest use of tin, 51% of world tin use in 2023 (International Tin Association; in the US solder took 11%, USGS). The common lead-free alloy SAC305 is 96.5% tin (AIM).Tin-lead solder is nearly half lead (PubChem), but the electronics industry has moved toward lead-free solders (USGS): 92% of solder for electronics was lead-free in 2023 (ITA).The lead-free alloy SAC305 contains 3% silver (AIM). In the US, brazing and solder took 3% of silver (USGS).The lead-free alloy SAC305 contains 0.5% copper (AIM).FR-4 laminate is woven fibreglass cloth with an epoxy binder (Wikipedia), and fibreglass is made from silica sand (Covia).A thin layer of copper foil is laminated to one or both sides of an FR-4 panel; these are called copper-clad laminates (Wikipedia; ChinaBaogao).FR-4 epoxy resin systems typically use bromine to resist fire (Wikipedia); a grade of the brominated flame retardant TBBPA is used to make epoxy resins for circuit boards (Wikipedia). Brominated flame retardants are one of bromine's two leading uses (USGS).Barite is used to make barium carbonate, which goes into dielectrics (Wikipedia). Barium titanate, the dielectric ceramic used in capacitors, can be made by heating barium carbonate with titanium dioxide (Wikipedia).Barium titanate, the ceramic in high-capacitance MLCCs, can be made by heating barium carbonate with titanium dioxide (Wikipedia); titanium dioxide comes from ilmenite and rutile (USGS).99% of MLCCs made worldwide use base-metal electrodes of nickel or copper; the industry moved from palladium and silver to cut cost (NASA, 2015). TDK replaced palladium electrodes with nickel in 1993 (Wikipedia).Platinum-group metals are used in multilayer ceramic capacitors (USGS). High-reliability MLCCs use palladium-silver electrodes (NASA, 2015).High-reliability MLCCs use precious-metal electrodes of palladium and silver (NASA, 2015).Connector contacts are copper alloys: beryllium copper is called the best copper alloy for contacts, connectors and cables (Wikipedia), and phosphor bronze (copper-tin-phosphorus) can replace it (USGS).Copper-clad laminate is the core material of circuit boards (ChinaBaogao); FR-4 is a common material for printed circuit boards (Wikipedia).Parts are soldered onto bare boards: Adafruit's BNO055 board is a "breakout PCB", and the Raspberry Pi Zero 2 W brief warns against damage to the printed circuit board.SAC305 lead-free solder is made for soldering printed circuits, by wave, hand and SMT reflow soldering (Conro; AIM).MLCCs store and release charge and absorb noise in phones, home appliances and IoT devices (Murata). The Raspberry Pi's RP3A0 package includes the decoupling capacitors that smooth its supply voltage (Raspberry Pi).Boards carry connectors: the Raspberry Pi Zero 2 W brief speaks of the board and its connectors, and Waveshare's servo adapter has a USB-C connector and a power connector.The Zero 2 W is a 65 × 30 mm board with thick internal copper layers that carry heat away from the processor (Raspberry Pi).Brass is copper and zinc: CW614N free-cutting brass is about 39% zinc. In the US, brass and bronze are the second use of zinc after galvanized steel.Brass is mostly copper: 57–59% in CW614N free-cutting brass.Free-cutting brass such as CW614N holds 2.5–3.5% lead so it machines cleanly; lead-free brasses exist.XT30 battery plugs (G1 harness, Open Duck Mini) have gold-plated brass contacts.Antimony is used in circuit boards to cut flammability further. A review lists two studies of scrap PC boards, parts and solder still on, with 0.45% and 1.97% antimony, so the share in the laminate alone is not known.ROBOTIS lists the XL330's motor type as 'Cored', a small DC motor.ROBOTIS lists the case and the gears as engineering plastic.Each servo has its own small controller board with an ARM Cortex-M0+ chip (64 MHz) that runs the position control.ROBOTIS names two chips: the ARM Cortex-M0+ microcontroller and the ams AS5601 12-bit contactless position sensor.MEMS microphones are silicon chips: the diaphragm is etched into a silicon wafer (Wikipedia). Pollen's HAT uses a MEMS microphone.Magnet wire is drawn from rod of pure electrolytic copper: Elektrisola starts from 8 mm rod with at least 99.90% copper, and most magnet wire is fully annealed, electrolytically refined copper (Elektrisola; Wikipedia).Small DC and brushless motors' coils are wound from magnet wire, usually copper (Wikipedia); maxon says its coreless windings are enamelled copper wire, a copper core with lacquer insulation (maxon). Nidec does not say what wire its coils use.The project recommends PLA for every printed part (0.12 mm layers, 15% infill); the BOM budgets under one roll, about $10.Steel shims (25 × 30 × 0.3 mm) carry the POM washers of the plain bearings, and 208 small screws hold the parts together (BOM).POM washers (20 × 30 × 1 mm) act as plain bearings where a servo has no idle horn (BOM).Two 18650 lithium-ion cells in series; the BOM recommends Murata VTC6, a nickel-manganese-cobalt cell (NKON).The 2S BMS is a small ready-made protection board (the BOM links Qury 2S 20A balanced boards).An XT30 plug joins the battery module to the trunk top (assembly guide).The USB-C charger is a small ready-made circuit board (Adeept's 2S 2A charging module, 40 × 20 mm).The switch, an XT30 plug and a cut Dynamixel cable carry the power to the robot hat (assembly guide).A circuit board with an IMU, servo connectors and audio, sized for a Raspberry Pi Zero; its parts list (revision C1) names a Bosch BMI088 IMU, a TI TLV320AIC3104 audio codec, a PAM8406 amplifier and a MEMS microphone.Microban's code reads a Bosch BMI088 IMU over I2C, the IMU of the hat's revision C1.The hat has an integrated MEMS microphone (README).Named chips include the BMI088 IMU, the TLV320AIC3104 codec and the PAM8406 amplifier (parts list, revision C1).DUV machines, which ASML also makes, print most of the layers in microchips, and ASML's EUV machines (the NXE:3800E) are being adopted by advanced DRAM makers (ASML annual report 2025).ASML's DUV machines, 'the workhorses of the industry', print the majority of layers in chips, older-generation chips included (ASML annual report 2025).ASML's DUV machines, 'the workhorses of the industry', print the majority of layers in chips, older-generation chips included (ASML annual report 2025).The printed parts make up Microban's body (its CAD and printing guide).19 ROBOTIS Dynamixel XL330-M288-T servos, one per joint (BOM).The robot runs on a Raspberry Pi Zero 2 W (README, BOM); a builder on the forum used a Pi 3A during a Zero 2 W shortage, with changed parts.Pollen's open RPI Robot Hat sits on the Raspberry Pi Zero 2W and carries the Dynamixel servo connectors and an IMU (Microban README; the hat's README).The battery module slides into the chest and plugs into the trunk top (assembly guide).The charger board and the switch sit in the trunk top and power the robot (assembly guide).The 19 servos are daisy-chained with 3-wire Dynamixel cables, some cut and re-crimped (JST EH) or soldered into splitters (assembly guide, BOM).Builders solder the cable splitters, the battery module, the charger and the switch (assembly guide).Quartz and silica sandQuartz and silica sandOil, gas and coal(plastics feedstock)Oil, gas and coal (plastics feedstock)Steel (gear, bearing andstainless grades)Steel (gear, bearing and stainless grades)Lithography machines (chipprinting)Lithography machines (chip printing)Mature-node chipfabrication (28 nm and…Mature-node chip fabrication (28 nm and older; analog and sensor chips)Memory chip fabrication(DRAM)Memory chip fabrication (DRAM)Raspberry Pi Zero 2 WRaspberry Pi Zero 2 WRP3A0 system-in-packageRP3A0 system-in-packageBroadcom BCM2710A1 dieBroadcom BCM2710A1 dieMicron LPDDR2 die (4 Gbit)Micron LPDDR2 die (4 Gbit)PLA filamentPLA filamentPLA resinPLA resinBattery-grade lithiumcompoundsBattery-grade lithium compounds40 nm-class chipfabrication40 nm-class chip fabricationLithium chemicalconversionLithium chemical conversionCopper smelting andrefiningCopper smelting and refiningLactic acid fermentationLactic acid fermentationLithium miningLithium miningCopper miningCopper miningPlant feedstockPlant feedstockIron ore miningIron ore miningSilicon metal smeltingSilicon metal smeltingChip packaging and test(OSAT)Chip packaging and test (OSAT)Small precision motors (DCand BLDC)Small precision motors (DC and BLDC)IMUs (motion sensors)IMUs (motion sensors)Lithium-ion cellsLithium-ion cellsCobalt miningCobalt miningCobalt refining (chemicalsand metal)Cobalt refining (chemicals and metal)Nickel miningNickel miningNickel smelting andrefiningNickel smelting and refiningNatural graphite miningNatural graphite miningBattery anode graphite(spherical natural and…Battery anode graphite (spherical natural and synthetic)Cathode active material(NMC, NCA, LCO, LFP)Cathode active material (NMC, NCA, LCO, LFP)Titanium minerals(ilmenite and rutile)Titanium minerals (ilmenite and rutile)Engineering plastics (ABS,PC, nylon, PEEK)Engineering plastics (ABS, PC, nylon, PEEK)Tin miningTin miningLead miningLead miningSilver miningSilver miningPalladium mining(platinum-group metals)Palladium mining (platinum-group metals)Antimony miningAntimony miningBromine (from brines)Bromine (from brines)Barite mining (barium)Barite mining (barium)Solder (tin alloys:lead-free SAC and…Solder (tin alloys: lead-free SAC and tin-lead)Copper-clad laminate (FR-4glass-fibre epoxy board…Copper-clad laminate (FR-4 glass-fibre epoxy board material)Printed circuit boards(bare boards)Printed circuit boards (bare boards)Multilayer ceramiccapacitors (MLCC)Multilayer ceramic capacitors (MLCC)Connectors and wiringharnessesConnectors and wiring harnessesElectronics assembly(circuit boards with part…Electronics assembly (circuit boards with parts soldered on)Zinc miningZinc miningBrass (copper-zinc alloy)Brass (copper-zinc alloy)Copper magnet wire(enamelled)Copper magnet wire (enamelled)ROBOTIS Dynamixel XL330servoROBOTIS Dynamixel XL330 servoMicrophonesMicrophonesMicrobanMicrobanStructure: printed PLAbodyStructure: printed PLA bodyMicroban battery module (2× 18650, 2S, with BMS)Microban battery module (2 × 18650, 2S, with BMS)Microban power parts:USB-C charger board,…Microban power parts: USB-C charger board, switch and XT30Pollen RPI Robot Hat (openboard, revision C1)Pollen RPI Robot Hat (open board, revision C1)